TDP is a very misunderstood concept these days because it used to be a hard upper limit but now it’s god knows what. The Spec Sheet is calling it “Processor Base Power”. What might that be you ask? Well of course it is
The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.
In other words it’s just marketing mumbo jumbo. According to other users the N150 can draw as much as 20 up to 35 watts even. The fact that the heat is radiating well through your case sounds like a positive if anything. This is x86 we’re talking about. The added complexity of that architecture over ARM comes at a price.
TDP is a very misunderstood concept these days because it used to be a hard upper limit but now it’s god knows what. The Spec Sheet is calling it “Processor Base Power”. What might that be you ask? Well of course it is
In other words it’s just marketing mumbo jumbo. According to other users the N150 can draw as much as 20 up to 35 watts even. The fact that the heat is radiating well through your case sounds like a positive if anything. This is x86 we’re talking about. The added complexity of that architecture over ARM comes at a price.